Scanning Ultrasonic Microscope

Centered on water immersion scanning acoustic microscopy, this product offers a high-precision, non-destructive internal defect detection solution for high-end manufacturing sectors, including semiconductor chips, advanced materials, microelectronics, and aerospace components.

Innovatively, the product enables the continuous, simultaneous triggering of reflection and transmission at the same coordinate: transmission imaging delivers the macro-level evaluation of overall density, while reflection imaging precisely locates micro-level defects, completely addressing the missed defects common in traditional single-function operation. Moreover, their pixel grids are 100% aligned, eliminating the need for manual post-processing stitching to facilitate precise, efficient batch quality inspection. In addition, an AI-driven defect analysis algorithm, trained on massive datasets and historical images, automatically identifies, flags, and counts anomalous regions. This significantly reduces labor costs and reliance on operator experience, driving the evolution of quality control toward a standardized and data-driven paradigm.

To meet various testing requirements, the product supports rapid switching among probes of different frequency bands (0.5–500 MHz), accommodating micron-level internal defect detection for ultra-thin chips and high-penetration testing for thick composites; it also offers 3 ultrasonic scanning modes (A/B/C) to evaluate complex samples through multiple dimensions (point, line, and plane), handling varying thickness (0.5–20 mm) and diverse materials—truly achieving all-in-one versatility. Furthermore, the product features a cantilever-mounted display that allows for free height/tilt angle adjustment, breaking the limitations of traditional fixed screens. Combined with a panoramic viewing window and an internal LED strip, it enables users to effortlessly monitor the operating status.